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ECA EIA-540FAAD
Detail Specification for Multi- Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment - Stabilized: May 2013
Organization:
ECIA - Electronic Components Industry Association
Year: 2013
Abstract: The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure dimensions (See Figure 1.)
b) Working voltage not to exceed 250 volts (rms).
c) Current not to exceed 1.0 amperes per pin.
OBJECT
The object of this Detail Specification is to provide all information required using Sectional Specification EIA-540F000 as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.
a) Maximum enclosure dimensions (See Figure 1.)
b) Working voltage not to exceed 250 volts (rms).
c) Current not to exceed 1.0 amperes per pin.
OBJECT
The object of this Detail Specification is to provide all information required using Sectional Specification EIA-540F000 as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.
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ECA EIA-540FAAD
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T17:21:48Z | |
| date available | 2017-09-04T17:21:48Z | |
| date copyright | 06/01/1992 (S 2013) | |
| date issued | 2013 | |
| identifier other | ZUEQGBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/144999 | |
| description abstract | The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions (See Figure 1.) b) Working voltage not to exceed 250 volts (rms). c) Current not to exceed 1.0 amperes per pin. OBJECT The object of this Detail Specification is to provide all information required using Sectional Specification EIA-540F000 as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes. | |
| language | English | |
| title | ECA EIA-540FAAD | num |
| title | Detail Specification for Multi- Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment - Stabilized: May 2013 | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2013 | |
| contenttype | fulltext |