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Gold Plating Study Test Report

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T17:22:35Z
date available2017-09-04T17:22:35Z
date copyright01/01/1990
date issued1990
identifier otherZWNDCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/145803
description abstractThe purpose of this study is to evaluate the performance characteristics of gold plating thicknesses when exposed to a severe series of environmental sequences. phenomenon which could potentially cause contact interface degradation. The program is designed to stress the component system beyond normal military qualification test sequences. established. The sequences as established were chosen for their impact on No pass/fail criteria was The data as generated is used for comparative purposes only.
languageEnglish
titleECA CB-12num
titleGold Plating Study Test Reporten
typestandard
page26
statusActive
treeECIA - Electronic Components Industry Association:;1990
contenttypefulltext


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