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ECA CB-12
Gold Plating Study Test Report
Organization:
ECIA - Electronic Components Industry Association
Year: 1990
Abstract: The purpose of this study is to evaluate the performance characteristics of gold plating thicknesses when exposed to a severe series of environmental sequences. phenomenon which could potentially cause contact interface degradation. The program is designed to stress the component system beyond normal military qualification test sequences. established. The sequences as established were chosen for their impact on No pass/fail criteria was The data as generated is used for comparative purposes only.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T17:22:35Z | |
| date available | 2017-09-04T17:22:35Z | |
| date copyright | 01/01/1990 | |
| date issued | 1990 | |
| identifier other | ZWNDCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/145803 | |
| description abstract | The purpose of this study is to evaluate the performance characteristics of gold plating thicknesses when exposed to a severe series of environmental sequences. phenomenon which could potentially cause contact interface degradation. The program is designed to stress the component system beyond normal military qualification test sequences. established. The sequences as established were chosen for their impact on No pass/fail criteria was The data as generated is used for comparative purposes only. | |
| language | English | |
| title | ECA CB-12 | num |
| title | Gold Plating Study Test Report | en |
| type | standard | |
| page | 26 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1990 | |
| contenttype | fulltext |