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ECA EIA-IS-47
Contact Termination Finish Standard for Surface Mount Devices - Stabilized: May 2013
Organization:
ECIA - Electronic Components Industry Association
Year: 2013
Abstract: Soldering of SMT components is performed, in general, at a relatively low soldering temperature (215°C). Thus, the reflow characteristics of the finish must be carefully considered. In addition, the solder joint itself is less forgiving to marginal conditions which may exist relative to solder joint strength, fillet size, pad/lead size ratios, etc. Thus finish compatibility is of prime importance. This document is a guide in establishing finishes for SMT terminations.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T17:36:36Z | |
| date available | 2017-09-04T17:36:36Z | |
| date copyright | 07/01/1987 (S 2013) | |
| date issued | 2013 | |
| identifier other | DKXVCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/159464 | |
| description abstract | Soldering of SMT components is performed, in general, at a relatively low soldering temperature (215°C). Thus, the reflow characteristics of the finish must be carefully considered. In addition, the solder joint itself is less forgiving to marginal conditions which may exist relative to solder joint strength, fillet size, pad/lead size ratios, etc. Thus finish compatibility is of prime importance. This document is a guide in establishing finishes for SMT terminations. | |
| language | English | |
| title | ECA EIA-IS-47 | num |
| title | Contact Termination Finish Standard for Surface Mount Devices - Stabilized: May 2013 | en |
| type | standard | |
| page | 10 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2013 | |
| contenttype | fulltext |