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Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T17:36:48Z
date available2017-09-04T17:36:48Z
date copyright09/14/2004
date issued2004
identifier otherDLKYGBAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/159660
description abstractThis document defines the requirements for documenting processes to assure customers and users of given products or sets of products, that their lead content is known. This document does not contain detailed descriptions of the processes to be documented, but lists high-level requirements for such processes, and areas of concern to the users and customers that must be addressed by the processes. The detailed information may be obtained from other sources, including the references of this document.
Purpose of this document
This document is intended for use by:
(1) manufacturers, suppliers, repairers, and maintainers of products to develop methods to test, analyze, or otherwise ascertain the lead content of the products they manufacture or supply; and
(2) customers and users of those products to know, on a quantitative basis, the lead content of the products, and to understand the method(s) by which it was determined.
This document describes the required elements of a Plan for assessing the lead content of a product, or set of products. The Plan owner is the manufacturer, supplier, repairer, or maintainer of the products. The Plan documents, in an organized manner, the baseline processes that the Plan owner uses to assess, with quantitative results, the lead content of the product, or set of products, It is expected that:
(a) the Plan will be a high-level reference to the processes used, but that the actual processes
(b) the Plan will be a baseline document that addresses the majority of issues associated with will be documented separately; and the Plan owner's use of lead-free solder, and will be tailorable to address programspecific issues.
languageEnglish
titleECA EIA/ECCB-952num
titleStandard for Plans to Determine Lead Content of Electronic Components and Related Equipmenten
typestandard
page16
statusActive
treeECIA - Electronic Components Industry Association:;2004
contenttypefulltext


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