ECA EIA/ECCB-952
Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment
Organization:
ECIA - Electronic Components Industry Association
Year: 2004
Abstract: This document defines the requirements for documenting processes to assure customers and users of given products or sets of products, that their lead content is known. This document does not contain detailed descriptions of the processes to be documented, but lists high-level requirements for such processes, and areas of concern to the users and customers that must be addressed by the processes. The detailed information may be obtained from other sources, including the references of this document.
Purpose of this document
This document is intended for use by:
(1) manufacturers, suppliers, repairers, and maintainers of products to develop methods to test, analyze, or otherwise ascertain the lead content of the products they manufacture or supply; and
(2) customers and users of those products to know, on a quantitative basis, the lead content of the products, and to understand the method(s) by which it was determined.
This document describes the required elements of a Plan for assessing the lead content of a product, or set of products. The Plan owner is the manufacturer, supplier, repairer, or maintainer of the products. The Plan documents, in an organized manner, the baseline processes that the Plan owner uses to assess, with quantitative results, the lead content of the product, or set of products, It is expected that:
(a) the Plan will be a high-level reference to the processes used, but that the actual processes
(b) the Plan will be a baseline document that addresses the majority of issues associated with will be documented separately; and the Plan owner's use of lead-free solder, and will be tailorable to address programspecific issues.
Purpose of this document
This document is intended for use by:
(1) manufacturers, suppliers, repairers, and maintainers of products to develop methods to test, analyze, or otherwise ascertain the lead content of the products they manufacture or supply; and
(2) customers and users of those products to know, on a quantitative basis, the lead content of the products, and to understand the method(s) by which it was determined.
This document describes the required elements of a Plan for assessing the lead content of a product, or set of products. The Plan owner is the manufacturer, supplier, repairer, or maintainer of the products. The Plan documents, in an organized manner, the baseline processes that the Plan owner uses to assess, with quantitative results, the lead content of the product, or set of products, It is expected that:
(a) the Plan will be a high-level reference to the processes used, but that the actual processes
(b) the Plan will be a baseline document that addresses the majority of issues associated with will be documented separately; and the Plan owner's use of lead-free solder, and will be tailorable to address programspecific issues.
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ECA EIA/ECCB-952
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contributor author | ECIA - Electronic Components Industry Association | |
date accessioned | 2017-09-04T17:36:48Z | |
date available | 2017-09-04T17:36:48Z | |
date copyright | 09/14/2004 | |
date issued | 2004 | |
identifier other | DLKYGBAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/159660 | |
description abstract | This document defines the requirements for documenting processes to assure customers and users of given products or sets of products, that their lead content is known. This document does not contain detailed descriptions of the processes to be documented, but lists high-level requirements for such processes, and areas of concern to the users and customers that must be addressed by the processes. The detailed information may be obtained from other sources, including the references of this document. Purpose of this document This document is intended for use by: (1) manufacturers, suppliers, repairers, and maintainers of products to develop methods to test, analyze, or otherwise ascertain the lead content of the products they manufacture or supply; and (2) customers and users of those products to know, on a quantitative basis, the lead content of the products, and to understand the method(s) by which it was determined. This document describes the required elements of a Plan for assessing the lead content of a product, or set of products. The Plan owner is the manufacturer, supplier, repairer, or maintainer of the products. The Plan documents, in an organized manner, the baseline processes that the Plan owner uses to assess, with quantitative results, the lead content of the product, or set of products, It is expected that: (a) the Plan will be a high-level reference to the processes used, but that the actual processes (b) the Plan will be a baseline document that addresses the majority of issues associated with will be documented separately; and the Plan owner's use of lead-free solder, and will be tailorable to address programspecific issues. | |
language | English | |
title | ECA EIA/ECCB-952 | num |
title | Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment | en |
type | standard | |
page | 16 | |
status | Active | |
tree | ECIA - Electronic Components Industry Association:;2004 | |
contenttype | fulltext |