ECA EIA-364-61

TP-61 Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards

contributor author	ECIA - Electronic Components Industry Association
date accessioned	2017-09-04T17:48:21Z
date available	2017-09-04T17:48:21Z
date copyright	02/01/2013
date issued	2013
identifier other	EQVZBFAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/171530
description abstract	This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain, or hot gas / vapor techniques. It is important to note that compliant pin connectors or sockets can be affected by solder rework if they are in close proximity to other connectors or sockets undergoing solder rework.
language	English
title	ECA EIA-364-61	num
title	TP-61 Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards	en
type	standard
page	18
status	Active
tree	ECIA - Electronic Components Industry Association:;2013
contenttype	fulltext