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ECA EIA-364-61
TP-61 Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
Organization:
ECIA - Electronic Components Industry Association
Year: 2013
Abstract: This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain, or hot gas / vapor techniques. It is important to note that compliant pin connectors or sockets can be affected by solder rework if they are in close proximity to other connectors or sockets undergoing solder rework.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T17:48:21Z | |
| date available | 2017-09-04T17:48:21Z | |
| date copyright | 02/01/2013 | |
| date issued | 2013 | |
| identifier other | EQVZBFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/171530 | |
| description abstract | This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain, or hot gas / vapor techniques. It is important to note that compliant pin connectors or sockets can be affected by solder rework if they are in close proximity to other connectors or sockets undergoing solder rework. | |
| language | English | |
| title | ECA EIA-364-61 | num |
| title | TP-61 Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards | en |
| type | standard | |
| page | 18 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2013 | |
| contenttype | fulltext |