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ECA EIA/ECA-364-110
TP-110 Thermal Cycling Test Procedure for Electrical Connectors and Sockets
Organization:
ECIA - Electronic Components Industry Association
Year: 2013
Abstract: This standard establishes a test method to expose connectors and sockets to extremes of high and low temperatures at a specified ramp up and ramp down rate.
NOTE — If the ramp time between temperature extremes is ≤ 2.0 minutes, this test procedure shall not be used. The procedure as specified in EIA-364-32 (Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets) shall be performed as a substitute.
NOTE — If the ramp time between temperature extremes is ≤ 2.0 minutes, this test procedure shall not be used. The procedure as specified in EIA-364-32 (Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets) shall be performed as a substitute.
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ECA EIA/ECA-364-110
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:37:03Z | |
| date available | 2017-09-04T16:37:03Z | |
| date copyright | 08/01/2006 (R 2013) | |
| date issued | 2013 | |
| identifier other | BQVZBFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho4703AF67081DAC4261598F1EFDEC014A0Facilities%20Engineeri/handle/yse/100578 | |
| description abstract | This standard establishes a test method to expose connectors and sockets to extremes of high and low temperatures at a specified ramp up and ramp down rate. NOTE — If the ramp time between temperature extremes is ≤ 2.0 minutes, this test procedure shall not be used. The procedure as specified in EIA-364-32 (Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets) shall be performed as a substitute. | |
| language | English | |
| title | ECA EIA/ECA-364-110 | num |
| title | TP-110 Thermal Cycling Test Procedure for Electrical Connectors and Sockets | en |
| type | standard | |
| page | 12 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2013 | |
| contenttype | fulltext |