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ECA EIA/ECA-955

SURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION)

Organization:
ECIA - Electronic Components Industry Association
Year: 2007

Abstract: Description
This document details the qualification requirements for surface mount aluminum chip capacitors with polymer cathode. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the supplier of their responsibility to their own company's internal qualification program.
Preconditioning
This process is intended to simulate exposure to the moisture, thermal and cleaning environments of the assembly process before qualification testing. The component assembly process simulation requirements for different types of processes are described in IPC-9504. It is required that a flux with a pH of less than 2 be used for this preconditioning requirement.
URI: http://yse.yabesh.ir/std;query=autho4703AF67081DAC4261598F1EFDEC014A0Facilities%20Engineeri/handle/yse/190798
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contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T18:07:50Z
date available2017-09-04T18:07:50Z
date copyright39356
date issued2007
identifier otherGQCCBCAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho4703AF67081DAC4261598F1EFDEC014A0Facilities%20Engineeri/handle/yse/190798
description abstractDescription
This document details the qualification requirements for surface mount aluminum chip capacitors with polymer cathode. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the supplier of their responsibility to their own company's internal qualification program.
Preconditioning
This process is intended to simulate exposure to the moisture, thermal and cleaning environments of the assembly process before qualification testing. The component assembly process simulation requirements for different types of processes are described in IPC-9504. It is required that a flux with a pH of less than 2 be used for this preconditioning requirement.
languageEnglish
titleECA EIA/ECA-955num
titleSURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION)en
typestandard
page15
statusActive
treeECIA - Electronic Components Industry Association:;2007
contenttypefulltext
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