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TeraHertz technology (THz); RF Hardware Modeling

ETSI GR THz 004 V1.1.1

contributor authorETSI - European Telecommunications Standards Institute
date accessioned2025-09-30T23:02:29Z
date available2025-09-30T23:02:29Z
date copyright2025.01
date issued2025
identifier othergr_THz004v010101p.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho4703AF679D405273/handle/yse/348253
languageEnglish
publisherETSI - European Telecommunications Standards Institute
titleTeraHertz technology (THz); RF Hardware Modelingen
titleETSI GR THz 004 V1.1.1num
typestandard
page66
statusPublished
treeETSI - European Telecommunications Standards Institute:;2025
contenttypefulltext
subject keywordschannel bandwidths
subject keywordscost impact
subject keywordsdevice complexity
subject keywordsfrequency range
subject keywordslarge antenna array
subject keywordsRF HW models
subject keywordsRF/analog impairments
subject keywordsTHz component technologies
subject keywordsTHz materials
subject keywordstransceiver efficiency
scopeThis work item will: (i) Assess the state-of-the-art materials for THz communication e.g., electronics, photonics, plasmonics (ii) Study the feasibility of different channel bandwidths considering component technologies, circuits and systems (iii) Study the effects of non-linear and frequency selective hardware (iv) Characterize RF/analog impairments based on simulations/measurements and obtain suitable RF impairment models in THz frequency range (v) Study low complexity large antenna array and packaging technologies (vi) Assess overall device complexity and cost impact (vii) Study the state of art for RF subsystems (transceiver, front end, antenna) in the THz frequency range (viii) Study the energy efficiency of state-of-the-art materials and RF subsystems on transmission and/or reception.


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