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ECA EIA/ECA-887-A
Thin Film Resistor Network Specification
Organization:
ECIA - Electronic Components Industry Association
Year: 2007
Abstract: Introduction
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
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ECA EIA/ECA-887-A
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T15:15:28Z | |
| date available | 2017-09-04T15:15:28Z | |
| date copyright | 01/01/2007 | |
| date issued | 2007 | |
| identifier other | ARNRXBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoCA5893FD081D527369727A00D52FAB6A/handle/yse/14424 | |
| description abstract | Introduction This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package. | |
| language | English | |
| title | ECA EIA/ECA-887-A | num |
| title | Thin Film Resistor Network Specification | en |
| type | standard | |
| page | 18 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2007 | |
| contenttype | fulltext |