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ECA 540H000
Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
Organization:
ECIA - Electronic Components Industry Association
Year: 1998
Abstract: This sectional specification relates to the burn-in sockets for Ball Grid Array (BGA) devices of assessed quality. The purpose of this specification is to provide a means of interchangeability between qualified devices and compatibility between the board and the BGA device and to provide standard socket test methods, gauges and performance requirements.
Object
The object of this specification is to define:
— A unified numbering system to be used for BGA sockets standardized by the Electronic Industries Association (EIA).
— Functional levels and standard test methods and gauges for use in the examination of these sockets.
— Appropriate reference dimensions of the mating devices and board layout to establish intermateability and interchangeability criteria as specified in the detail.
Test severity and performance requirements prescribed in the detail specifications referring to this sectional specification shall be equal to or greater than those specified herein; degradation is not permitted.
Object
The object of this specification is to define:
— A unified numbering system to be used for BGA sockets standardized by the Electronic Industries Association (EIA).
— Functional levels and standard test methods and gauges for use in the examination of these sockets.
— Appropriate reference dimensions of the mating devices and board layout to establish intermateability and interchangeability criteria as specified in the detail.
Test severity and performance requirements prescribed in the detail specifications referring to this sectional specification shall be equal to or greater than those specified herein; degradation is not permitted.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T15:22:12Z | |
| date available | 2017-09-04T15:22:12Z | |
| date copyright | 01/01/1998 | |
| date issued | 1998 | |
| identifier other | NBJYCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoCA5893FD081D527369727A00D52FAB6A/handle/yse/22247 | |
| description abstract | This sectional specification relates to the burn-in sockets for Ball Grid Array (BGA) devices of assessed quality. The purpose of this specification is to provide a means of interchangeability between qualified devices and compatibility between the board and the BGA device and to provide standard socket test methods, gauges and performance requirements. Object The object of this specification is to define: — A unified numbering system to be used for BGA sockets standardized by the Electronic Industries Association (EIA). — Functional levels and standard test methods and gauges for use in the examination of these sockets. — Appropriate reference dimensions of the mating devices and board layout to establish intermateability and interchangeability criteria as specified in the detail. Test severity and performance requirements prescribed in the detail specifications referring to this sectional specification shall be equal to or greater than those specified herein; degradation is not permitted. | |
| language | English | |
| title | ECA 540H000 | num |
| title | Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment | en |
| type | standard | |
| page | 21 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1998 | |
| contenttype | fulltext |