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ECA CB-11
Surface Mounting of Multilayer Ceramic Chip Capacitors, Guidelines fo
Organization:
ECIA - Electronic Components Industry Association
Year: 1986
Abstract: SCOPE AND INTRODUCTION
This document provides guidelines for the use of multilayer ceramic chip capacitors, their design and construction as well as handling, mounting .and connection requirements. Use of chip capacitors to construct hybrid microcircuits is a mature technology in widespread use. The use of capacitor chips on printed wiring or printed circuit boards as well as other larger area substrates such as ceramic or porcelainized-steel, is a comparatively new technology generally referred to as SMT, surface mount technology.
The physical and mechanical aspects of -the chip and its use are the primary subjects of this document. Included is a review of the design and materials employed in the chip's construction, as well as the material and process requirements for their mounting and interconnection by soldering.
Guidelines for the selection and use of these chips based on electrical ratings, values and performance characteristics are given in ELA specification EIA-198-C, Ceramic Dielectric Capacitors.
Note that this document concentrates and directs its information to the mounting and interconnection of chips by soldering.
PURPOSE
'The information is provided to assist the user's various engineering and manufacturing personnel in the making of informed choices in regard to these chip capacitors; their selection, specification and circuit assembly processing.
This document provides guidelines for the use of multilayer ceramic chip capacitors, their design and construction as well as handling, mounting .and connection requirements. Use of chip capacitors to construct hybrid microcircuits is a mature technology in widespread use. The use of capacitor chips on printed wiring or printed circuit boards as well as other larger area substrates such as ceramic or porcelainized-steel, is a comparatively new technology generally referred to as SMT, surface mount technology.
The physical and mechanical aspects of -the chip and its use are the primary subjects of this document. Included is a review of the design and materials employed in the chip's construction, as well as the material and process requirements for their mounting and interconnection by soldering.
Guidelines for the selection and use of these chips based on electrical ratings, values and performance characteristics are given in ELA specification EIA-198-C, Ceramic Dielectric Capacitors.
Note that this document concentrates and directs its information to the mounting and interconnection of chips by soldering.
PURPOSE
'The information is provided to assist the user's various engineering and manufacturing personnel in the making of informed choices in regard to these chip capacitors; their selection, specification and circuit assembly processing.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T15:25:30Z | |
| date available | 2017-09-04T15:25:30Z | |
| date copyright | 01/01/1986 | |
| date issued | 1986 | |
| identifier other | NLKYCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoCA5893FD081D527369727A00D52FAB6A/handle/yse/26060 | |
| description abstract | SCOPE AND INTRODUCTION This document provides guidelines for the use of multilayer ceramic chip capacitors, their design and construction as well as handling, mounting .and connection requirements. Use of chip capacitors to construct hybrid microcircuits is a mature technology in widespread use. The use of capacitor chips on printed wiring or printed circuit boards as well as other larger area substrates such as ceramic or porcelainized-steel, is a comparatively new technology generally referred to as SMT, surface mount technology. The physical and mechanical aspects of -the chip and its use are the primary subjects of this document. Included is a review of the design and materials employed in the chip's construction, as well as the material and process requirements for their mounting and interconnection by soldering. Guidelines for the selection and use of these chips based on electrical ratings, values and performance characteristics are given in ELA specification EIA-198-C, Ceramic Dielectric Capacitors. Note that this document concentrates and directs its information to the mounting and interconnection of chips by soldering. PURPOSE 'The information is provided to assist the user's various engineering and manufacturing personnel in the making of informed choices in regard to these chip capacitors; their selection, specification and circuit assembly processing. | |
| language | English | |
| title | ECA CB-11 | num |
| title | Surface Mounting of Multilayer Ceramic Chip Capacitors, Guidelines fo | en |
| type | standard | |
| page | 56 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1986 | |
| contenttype | fulltext |