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ECA EIA-364-88A
TP-88A RESIDUAL MAGNETISM TEST PROCEDURE FOR ELECTRICAL CONNECTORS, CONTACTS AND SOCKETS
Organization:
ECIA - Electronic Components Industry Association
Year: 2009
Abstract: This standard establishes a test method to determine the residual magnetism of a connector after exposure to a specified magnetic field.
NOTE — Connectors with a relative magnetism of 2 MU as determined by EIA-364-54 can satisfy the nonmagnetism requirements in most applications. Residual magnetism should only be required if the magnetic field constraints as associated with space flight applications warrant such stringent requirements.
NOTE — Connectors with a relative magnetism of 2 MU as determined by EIA-364-54 can satisfy the nonmagnetism requirements in most applications. Residual magnetism should only be required if the magnetic field constraints as associated with space flight applications warrant such stringent requirements.
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ECA EIA-364-88A
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T15:27:30Z | |
| date available | 2017-09-04T15:27:30Z | |
| date copyright | 40118 | |
| date issued | 2009 | |
| identifier other | NROHPCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoCA5893FD081D527369727A00D52FAB6A/handle/yse/28420 | |
| description abstract | This standard establishes a test method to determine the residual magnetism of a connector after exposure to a specified magnetic field. NOTE — Connectors with a relative magnetism of 2 MU as determined by EIA-364-54 can satisfy the nonmagnetism requirements in most applications. Residual magnetism should only be required if the magnetic field constraints as associated with space flight applications warrant such stringent requirements. | |
| language | English | |
| title | ECA EIA-364-88A | num |
| title | TP-88A RESIDUAL MAGNETISM TEST PROCEDURE FOR ELECTRICAL CONNECTORS, CONTACTS AND SOCKETS | en |
| type | standard | |
| page | 13 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2009 | |
| contenttype | fulltext |