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ECA EIA-763
Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling
Organization:
ECIA - Electronic Components Industry Association
Year: 2002
Abstract: This standard covers requirements for punched and embossed carrier taping of components such as silicon dies, bumped flip chip devices, and chip scale packages. Refer to EIA 48 1-1 for current industry standard for 8 mm and 12 mm taping of surface mount components.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T15:58:13Z | |
| date available | 2017-09-04T15:58:13Z | |
| date copyright | 06/01/2002 | |
| date issued | 2002 | |
| identifier other | RCICYAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoCA5893FD081D527369727A00D52FAB6A/handle/yse/61443 | |
| description abstract | This standard covers requirements for punched and embossed carrier taping of components such as silicon dies, bumped flip chip devices, and chip scale packages. Refer to EIA 48 1-1 for current industry standard for 8 mm and 12 mm taping of surface mount components. | |
| language | English | |
| title | ECA EIA-763 | num |
| title | Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling | en |
| type | standard | |
| page | 28 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2002 | |
| contenttype | fulltext |