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ECA 186-10E
Passive Electronic Component Parts, Test Methods for; Method 10: Effect of Soldering
Organization:
ECIA - Electronic Components Industry Association
Year: 1978
Abstract: PURPOSE
This test is performed to determine the effect of normal soldering operations on component parts. Excessive changes in electrical characteristics or mechanical damage to a component part are often caused by the short-time application of high heat, such as is applied to integral component terminastions by a soldering iron or a solder-bath dip in assembly operations. The effect of soldering test is intended to simulate these manufacturing conditions and detect faults in component parts which otherwise may not be noticed until after final equipment assembly.
NOTE 1: (For a test for determining the ability of component part terminations to accept solder, see EIA Standard RS-178-A, Solderability Test Standard.)
NOTE 2: (A recommended solder is one in accordance with ASTM B32, Grade A, having a nominal composition of 60% tin and 40% lead.)
This test is performed to determine the effect of normal soldering operations on component parts. Excessive changes in electrical characteristics or mechanical damage to a component part are often caused by the short-time application of high heat, such as is applied to integral component terminastions by a soldering iron or a solder-bath dip in assembly operations. The effect of soldering test is intended to simulate these manufacturing conditions and detect faults in component parts which otherwise may not be noticed until after final equipment assembly.
NOTE 1: (For a test for determining the ability of component part terminations to accept solder, see EIA Standard RS-178-A, Solderability Test Standard.)
NOTE 2: (A recommended solder is one in accordance with ASTM B32, Grade A, having a nominal composition of 60% tin and 40% lead.)
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:34:28Z | |
| date available | 2017-09-04T16:34:28Z | |
| date copyright | 28764 | |
| date issued | 1978 | |
| identifier other | UXJPCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoCA58earD081D206861598F1EFDEC9/handle/yse/97974 | |
| description abstract | PURPOSE This test is performed to determine the effect of normal soldering operations on component parts. Excessive changes in electrical characteristics or mechanical damage to a component part are often caused by the short-time application of high heat, such as is applied to integral component terminastions by a soldering iron or a solder-bath dip in assembly operations. The effect of soldering test is intended to simulate these manufacturing conditions and detect faults in component parts which otherwise may not be noticed until after final equipment assembly. NOTE 1: (For a test for determining the ability of component part terminations to accept solder, see EIA Standard RS-178-A, Solderability Test Standard.) NOTE 2: (A recommended solder is one in accordance with ASTM B32, Grade A, having a nominal composition of 60% tin and 40% lead.) | |
| language | English | |
| title | ECA 186-10E | num |
| title | Passive Electronic Component Parts, Test Methods for; Method 10: Effect of Soldering | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1978 | |
| contenttype | fulltext |