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IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

IEEE Std 1838-2019

contributor authorIEEE - The Institute of Electrical and Electronics Engineers, Inc.
date accessioned2020-09-15T20:15:07Z
date available2020-09-15T20:15:07Z
date issued2020
identifier isbn978-1-5044-5824
identifier other09036129.pdf
identifier other09036129.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF2377D8669B749A/handle/yse/288458
languageEnglish
titleIEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuitsen
titleIEEE Std 1838-2019num
typeStandard
page73
treeIEEE - The Institute of Electrical and Electronics Engineers, Inc.:;2020
contenttypeFulltext
subject keywordsTSV
subject keywordstest
subject keywordsflexible parallel port
subject keywordssecondary test access port
subject keywordsprimary test access port
subject keywordsIEEE 1838
subject keywordsFPP
subject keywords3D test access
subject keywordsmulti-tower stack
subject keywordsscan
subject keywordsthrough-silicon via


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