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IPC 6018B
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2011
Abstract: This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.
The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers conforming to IPC-6016.
Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (Microwave) printed boards.
The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers conforming to IPC-6016.
Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (Microwave) printed boards.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:47:51Z | |
| date available | 2017-09-04T17:47:51Z | |
| date copyright | 40848 | |
| date issued | 2011 | |
| identifier other | EPUPREAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/171109 | |
| description abstract | This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers conforming to IPC-6016. Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (Microwave) printed boards. | |
| language | English | |
| title | IPC 6018B | num |
| title | Qualification and Performance Specification for High Frequency (Microwave) Printed Boards | en |
| type | standard | |
| page | 56 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2011 | |
| contenttype | fulltext |