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IPC TM-650 2.3.17.2B
Resin Flow of "No Flow" Prepreg
Organization:
IPC - Association Connecting Electronics Industries
Year: 1997
Abstract: This test method is designed to measure the Resin Flow of "no flow" prepreg used for bonding and adhesion without formation of resin bead as caused by flow of the resin.
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IPC TM-650 2.3.17.2B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:52:53Z | |
| date available | 2017-09-04T17:52:53Z | |
| date copyright | 08/01/1997 | |
| date issued | 1997 | |
| identifier other | FDAMCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/176048 | |
| description abstract | This test method is designed to measure the Resin Flow of "no flow" prepreg used for bonding and adhesion without formation of resin bead as caused by flow of the resin. | |
| language | English | |
| title | IPC TM-650 2.3.17.2B | num |
| title | Resin Flow of "No Flow" Prepreg | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |