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IPC TM-650 2.2.20
Solder Paste Metal Content by Weight
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This procedure determines the percent metal content for solder paste.
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IPC TM-650 2.2.20
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:57:32Z | |
| date available | 2017-09-04T17:57:32Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | AAAPCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/180651 | |
| description abstract | This procedure determines the percent metal content for solder paste. | |
| language | English | |
| title | IPC TM-650 2.2.20 | num |
| title | Solder Paste Metal Content by Weight | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |