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IPC IPC/JEDEC-9702
Monotonic Bend Characterization of Board-Level Interconnects
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:00:34Z | |
| date available | 2017-09-04T18:00:34Z | |
| date copyright | 06/01/2004 | |
| date issued | 2004 | |
| identifier other | FXBQGBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/183613 | |
| description abstract | This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/ fail requirements are typically specific to each device application and are outside the scope of this document. | |
| language | English | |
| title | IPC IPC/JEDEC-9702 | num |
| title | Monotonic Bend Characterization of Board-Level Interconnects | en |
| type | standard | |
| page | 28 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |
