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IPC IPC/JEDEC-9702

Monotonic Bend Characterization of Board-Level Interconnects

Organization:
IPC - Association Connecting Electronics Industries
Year: 2004

Abstract: This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/ fail requirements are typically specific to each device application and are outside the scope of this document.
URI: http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/183613
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  • IPC - Association Connecting Electronics Industries
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    IPC IPC/JEDEC-9702

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:00:34Z
date available2017-09-04T18:00:34Z
date copyright06/01/2004
date issued2004
identifier otherFXBQGBAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/183613
description abstractThis publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/ fail requirements are typically specific to each device application and are outside the scope of this document.
languageEnglish
titleIPC IPC/JEDEC-9702num
titleMonotonic Bend Characterization of Board-Level Interconnectsen
typestandard
page28
statusActive
treeIPC - Association Connecting Electronics Industries:;2004
contenttypefulltext
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