• 0
    • ارسال درخواست
    • حذف همه
    • Industrial Standards
    • Defence Standards
  • درباره ما
  • درخواست موردی
  • فهرست استانداردها
    • Industrial Standards
    • Defence Standards
  • راهنما
  • Login
  • لیست خرید شما 0
    • ارسال درخواست
    • حذف همه
View Item 
  •   YSE
  • Industrial Standards
  • IPC - Association Connecting Electronics Industries
  • View Item
  •   YSE
  • Industrial Standards
  • IPC - Association Connecting Electronics Industries
  • View Item
  • All Fields
  • Title(or Doc Num)
  • Organization
  • Year
  • Subject
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Archive

IPC 2614

Sectional Requirements for Board Fabrication Documentation

Organization:
IPC - Association Connecting Electronics Industries
Year: 2010

Abstract: This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.
Purpose
The purpose of the IPC-2614 is to establish a consistent methodology for the descriptions that are transferred from the Design function to the Board fabricators. Included are the physical characteristics as well as the accept/reject criteria governing the quality of the delivered product. Some techniques will be identified as mandatory information in order to avoid ambiguity; other methods may be shown as a recommendation in order to establish consistent communication between design and manufacturing functions
URI: http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/186057
Collections :
  • IPC - Association Connecting Electronics Industries
  • Download PDF : (1.109Mb)
  • Show Full MetaData Hide Full MetaData
  • Statistics

    IPC 2614

Show full item record

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:03:07Z
date available2017-09-04T18:03:07Z
date copyright03/01/2010
date issued2010
identifier otherGDKGRCAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/186057
description abstractThis standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.
Purpose
The purpose of the IPC-2614 is to establish a consistent methodology for the descriptions that are transferred from the Design function to the Board fabricators. Included are the physical characteristics as well as the accept/reject criteria governing the quality of the delivered product. Some techniques will be identified as mandatory information in order to avoid ambiguity; other methods may be shown as a recommendation in order to establish consistent communication between design and manufacturing functions
languageEnglish
titleIPC 2614num
titleSectional Requirements for Board Fabrication Documentationen
typestandard
page72
statusActive
treeIPC - Association Connecting Electronics Industries:;2010
contenttypefulltext
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian
 
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian