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IPC 2614
Sectional Requirements for Board Fabrication Documentation
Organization:
IPC - Association Connecting Electronics Industries
Year: 2010
Abstract: This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.
Purpose
The purpose of the IPC-2614 is to establish a consistent methodology for the descriptions that are transferred from the Design function to the Board fabricators. Included are the physical characteristics as well as the accept/reject criteria governing the quality of the delivered product. Some techniques will be identified as mandatory information in order to avoid ambiguity; other methods may be shown as a recommendation in order to establish consistent communication between design and manufacturing functions
Purpose
The purpose of the IPC-2614 is to establish a consistent methodology for the descriptions that are transferred from the Design function to the Board fabricators. Included are the physical characteristics as well as the accept/reject criteria governing the quality of the delivered product. Some techniques will be identified as mandatory information in order to avoid ambiguity; other methods may be shown as a recommendation in order to establish consistent communication between design and manufacturing functions
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:03:07Z | |
| date available | 2017-09-04T18:03:07Z | |
| date copyright | 03/01/2010 | |
| date issued | 2010 | |
| identifier other | GDKGRCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/186057 | |
| description abstract | This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions. Purpose The purpose of the IPC-2614 is to establish a consistent methodology for the descriptions that are transferred from the Design function to the Board fabricators. Included are the physical characteristics as well as the accept/reject criteria governing the quality of the delivered product. Some techniques will be identified as mandatory information in order to avoid ambiguity; other methods may be shown as a recommendation in order to establish consistent communication between design and manufacturing functions | |
| language | English | |
| title | IPC 2614 | num |
| title | Sectional Requirements for Board Fabrication Documentation | en |
| type | standard | |
| page | 72 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2010 | |
| contenttype | fulltext |