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IPC 9502
PWB Assembly Soldering Process Guideline for Electronic Components
Organization:
IPC - Association Connecting Electronics Industries
Year: 1999
Abstract: This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged.
This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents, listed in applicable documents.
Note: This document does not address the increased temperature requirements of lead-free solders.
This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents, listed in applicable documents.
Note: This document does not address the increased temperature requirements of lead-free solders.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:03:08Z | |
| date available | 2017-09-04T18:03:08Z | |
| date copyright | 04/01/1999 | |
| date issued | 1999 | |
| identifier other | GDNIJAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/186097 | |
| description abstract | This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents, listed in applicable documents. Note: This document does not address the increased temperature requirements of lead-free solders. | |
| language | English | |
| title | IPC 9502 | num |
| title | PWB Assembly Soldering Process Guideline for Electronic Components | en |
| type | standard | |
| page | 23 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1999 | |
| contenttype | fulltext |