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IPC 7530
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
Organization:
IPC - Association Connecting Electronics Industries
Year: 2001
Abstract: This guideline document addresses the issues pertinent to temperature profiling of electronic assemblies for mass soldering processes (reflow and wave).
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:06:22Z | |
| date available | 2017-09-04T18:06:22Z | |
| date copyright | 05/01/2001 | |
| date issued | 2001 | |
| identifier other | GMDISAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/189325 | |
| description abstract | This guideline document addresses the issues pertinent to temperature profiling of electronic assemblies for mass soldering processes (reflow and wave). | |
| language | English | |
| title | IPC 7530 | num |
| title | Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2001 | |
| contenttype | fulltext |