IPC TM-650 2.4.28B

Adhesion, Solder Mask (Non-Melting Metals)

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T18:10:04Z
date available	2017-09-04T18:10:04Z
date copyright	08/01/1997
date issued	1997
identifier other	GWJDCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/193103
description abstract	This test method defines the procedure for determining the adhesion of solder masks used over nonmelting metals such as copper, gold, nickel, and tin printed wiring boards, both prior to and after soldering.
language	English
title	IPC TM-650 2.4.28B	num
title	Adhesion, Solder Mask (Non-Melting Metals)	en
type	standard
page	1
status	Active
tree	IPC - Association Connecting Electronics Industries:;1997
contenttype	fulltext