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Adhesion, Solder Mask (Non-Melting Metals)

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:10:04Z
date available2017-09-04T18:10:04Z
date copyright08/01/1997
date issued1997
identifier otherGWJDCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/193103
description abstractThis test method defines the procedure for determining the adhesion of solder masks used over nonmelting metals such as copper, gold, nickel, and tin printed wiring boards, both prior to and after soldering.
languageEnglish
titleIPC TM-650 2.4.28Bnum
titleAdhesion, Solder Mask (Non-Melting Metals)en
typestandard
page1
statusActive
treeIPC - Association Connecting Electronics Industries:;1997
contenttypefulltext


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