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IPC TM-650 2.4.28B
Adhesion, Solder Mask (Non-Melting Metals)
Organization:
IPC - Association Connecting Electronics Industries
Year: 1997
Abstract: This test method defines the procedure for determining the adhesion of solder masks used over nonmelting metals such as copper, gold, nickel, and tin printed wiring boards, both prior to and after soldering.
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IPC TM-650 2.4.28B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:10:04Z | |
| date available | 2017-09-04T18:10:04Z | |
| date copyright | 08/01/1997 | |
| date issued | 1997 | |
| identifier other | GWJDCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/193103 | |
| description abstract | This test method defines the procedure for determining the adhesion of solder masks used over nonmelting metals such as copper, gold, nickel, and tin printed wiring boards, both prior to and after soldering. | |
| language | English | |
| title | IPC TM-650 2.4.28B | num |
| title | Adhesion, Solder Mask (Non-Melting Metals) | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |