IPC 6013C

Qualification and Performance Specification for Flexible Printed Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T18:26:16Z
date available	2017-09-04T18:26:16Z
date copyright	2013.12.01
date issued	2013
identifier other	IKYCHFAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/208430
description abstract	This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes, and blind/buried vias. The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive. Revision level changes are described in 1.7. Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible printed boards designed to IPC-2221 and IPC-2223.
language	English
title	IPC 6013C	num
title	Qualification and Performance Specification for Flexible Printed Boards	en
type	standard
page	72
status	Active
tree	IPC - Association Connecting Electronics Industries:;2013
contenttype	fulltext