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Qualification and Performance Specification for Flexible Printed Boards

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:26:16Z
date available2017-09-04T18:26:16Z
date copyright2013.12.01
date issued2013
identifier otherIKYCHFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/208430
description abstractThis specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes, and blind/buried vias.
The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.
The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
Purpose
The purpose of this specification is to provide requirements for qualification and performance of flexible printed boards designed to IPC-2221 and IPC-2223.
languageEnglish
titleIPC 6013Cnum
titleQualification and Performance Specification for Flexible Printed Boardsen
typestandard
page72
statusActive
treeIPC - Association Connecting Electronics Industries:;2013
contenttypefulltext


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