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IPC 6013C
Qualification and Performance Specification for Flexible Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2013
Abstract: This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes, and blind/buried vias.
The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.
The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
Purpose
The purpose of this specification is to provide requirements for qualification and performance of flexible printed boards designed to IPC-2221 and IPC-2223.
The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.
The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
Purpose
The purpose of this specification is to provide requirements for qualification and performance of flexible printed boards designed to IPC-2221 and IPC-2223.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:26:16Z | |
| date available | 2017-09-04T18:26:16Z | |
| date copyright | 2013.12.01 | |
| date issued | 2013 | |
| identifier other | IKYCHFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/208430 | |
| description abstract | This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes, and blind/buried vias. The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive. Revision level changes are described in 1.7. Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible printed boards designed to IPC-2221 and IPC-2223. | |
| language | English | |
| title | IPC 6013C | num |
| title | Qualification and Performance Specification for Flexible Printed Boards | en |
| type | standard | |
| page | 72 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2013 | |
| contenttype | fulltext |