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NASA-LLIS-0416

Lessons Learned - Voyager - S/X-Band Antenna Subsystem Intermodulation Products at Cold Temperatures (~1976)

Organization:
NASA - National Aeronautics and Space Administration (NASA)
Year: 1996

Abstract: Abstract:
Qualification testing at extreme cold temperatures found that noise could be generated from the minute differential expansion between semi-rigid aluminum coaxial cables and their attached stainless steel shells. Beware of the intermodulation product phenomenon, and test for it during antenna subsystem pre- and post-environmental tests, after antenna installation on the spacecraft, and prelaunch.
URI: http://yse.yabesh.ir/std;query=author:%22NAVY%20-%206159DD6E273C9FCD0Facil/handle/yse/221450
Subject: Connector Fabrication Techniques
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  • NASA - National Aeronautics and Space Administration (NASA)
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    NASA-LLIS-0416

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contributor authorNASA - National Aeronautics and Space Administration (NASA)
date accessioned2017-09-04T18:39:47Z
date available2017-09-04T18:39:47Z
date copyright07/01/1996
date issued1996
identifier otherJTBEQCAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=author:%22NAVY%20-%206159DD6E273C9FCD0Facil/handle/yse/221450
description abstractAbstract:
Qualification testing at extreme cold temperatures found that noise could be generated from the minute differential expansion between semi-rigid aluminum coaxial cables and their attached stainless steel shells. Beware of the intermodulation product phenomenon, and test for it during antenna subsystem pre- and post-environmental tests, after antenna installation on the spacecraft, and prelaunch.
languageEnglish
titleNASA-LLIS-0416num
titleLessons Learned - Voyager - S/X-Band Antenna Subsystem Intermodulation Products at Cold Temperatures (~1976)en
typestandard
page3
statusActive
treeNASA - National Aeronautics and Space Administration (NASA):;1996
contenttypefulltext
subject keywordsConnector Fabrication Techniques
subject keywordsHardware
subject keywordsRF Intermodulation
subject keywordsTest & Verification
subject keywordsThermal Expansion
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