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JEDEC JEP123

Guideline for Measurement of Electronic Package Inductance and Capacitance Model Parameters

Organization:
JEDEC - Solid State Technology Association
Year: 1995

Abstract: The need for this guideline arose from widespread lack of consistency in characterizing electrical parameters of electronic packages, which existed in the industry until the early 1990s. Then, the JEDEC Committee JC-15 provided the forum where various methods were discussed and commonality in approach emerged. The result is that today we have relatively consistent results in measuring and reporting electrical package parameters, as well as specialized tools (e.g., the IPA-510, the interconnect parameter analyzer) which were developed to support the methodology. 
URI: http://yse.yabesh.ir/std;jsery=auth=4703AF67081DAC4/handle/yse/120810
Subject: Capacitance Model
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contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T16:57:18Z
date available2017-09-04T16:57:18Z
date copyright34973
date issued1995
identifier otherXGILCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=auth=4703AF67081DAC4/handle/yse/120810
description abstractThe need for this guideline arose from widespread lack of consistency in characterizing electrical parameters of electronic packages, which existed in the industry until the early 1990s. Then, the JEDEC Committee JC-15 provided the forum where various methods were discussed and commonality in approach emerged. The result is that today we have relatively consistent results in measuring and reporting electrical package parameters, as well as specialized tools (e.g., the IPA-510, the interconnect parameter analyzer) which were developed to support the methodology. 
languageEnglish
titleJEDEC JEP123num
titleGuideline for Measurement of Electronic Package Inductance and Capacitance Model Parametersen
typestandard
page25
statusActive
treeJEDEC - Solid State Technology Association:;1995
contenttypefulltext
subject keywordsCapacitance Model
subject keywordsInductance Model
subject keywordsMeasurement - Package Inductance/Capacitance Model Parameters
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