JEDEC JESD51-6

Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T17:16:38Z
date available	2017-09-04T17:16:38Z
date copyright	03/01/1999
date issued	1999
identifier other	ZGHBDBAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quessionid=2A40ear/handle/yse/140033
description abstract	This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard thermal test board.
language	English
title	JEDEC JESD51-6	num
title	Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)	en
type	standard
page	20
status	Active
tree	JEDEC - Solid State Technology Association:;1999
contenttype	fulltext
subject keywords	Environmental Conditions - Forced Convection
subject keywords	Forced Convection (Moving Air)
subject keywords	Test Method - Environmental Conditions