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JEDEC JESD51-6
Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
Organization:
JEDEC - Solid State Technology Association
Year: 1999
Abstract: This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard thermal test board.
Subject: Environmental Conditions - Forced Convection
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T17:16:38Z | |
| date available | 2017-09-04T17:16:38Z | |
| date copyright | 03/01/1999 | |
| date issued | 1999 | |
| identifier other | ZGHBDBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=2A40ear/handle/yse/140033 | |
| description abstract | This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard thermal test board. | |
| language | English | |
| title | JEDEC JESD51-6 | num |
| title | Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;1999 | |
| contenttype | fulltext | |
| subject keywords | Environmental Conditions - Forced Convection | |
| subject keywords | Forced Convection (Moving Air) | |
| subject keywords | Test Method - Environmental Conditions |