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JEDEC JEP167
Characterization of Interfacial Adhesion in Semiconductor Packages
Organization:
JEDEC - Solid State Technology Association
Year: 2013
Abstract: This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
NOTE Inclusion in this directory of methods does not imply applicability to all die-package configurations.
NOTE Inclusion in this directory of methods does not imply applicability to all die-package configurations.
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T17:35:05Z | |
| date available | 2017-09-04T17:35:05Z | |
| date copyright | 04/01/2013 | |
| date issued | 2013 | |
| identifier other | DHEFCFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=2A40ear/handle/yse/158023 | |
| description abstract | This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle. NOTE Inclusion in this directory of methods does not imply applicability to all die-package configurations. | |
| language | English | |
| title | JEDEC JEP167 | num |
| title | Characterization of Interfacial Adhesion in Semiconductor Packages | en |
| type | standard | |
| page | 30 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2013 | |
| contenttype | fulltext |