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JEDEC JEP149
Application Thermal Derating Methodologies
Organization:
JEDEC - Solid State Technology Association
Year: 2004
Abstract: This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such methodologies.
Subject: Application
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T16:34:23Z | |
| date available | 2017-09-04T16:34:23Z | |
| date copyright | 38292 | |
| date issued | 2004 | |
| identifier other | UXCQGBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=2A40ear/handle/yse/97858 | |
| description abstract | This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such methodologies. | |
| language | English | |
| title | JEDEC JEP149 | num |
| title | Application Thermal Derating Methodologies | en |
| type | standard | |
| page | 18 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2004 | |
| contenttype | fulltext | |
| subject keywords | Application | |
| subject keywords | Derating | |
| subject keywords | Junction Temperature | |
| subject keywords | Thermal |