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JEDEC JEP139
Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding
Organization:
JEDEC - Solid State Technology Association
Year: 2000
Abstract: This document describes a constant temperature (isothermal) aging method for testing aluminum (Al) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding. This method is valid for metallization/dielectric systems in which the dielectric is deposited onto the metallization at a temperature considerably above the intended use temperature, and above or equal to the deposition temperature of the metal. Although this is a wafer test, it is not a fast (less than 5 minutes per probe) test. It is intended to be used for lifetime prediction and failure analysis, not for production Go-NoGo lot checking.
Subject: Metal Voiding
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T16:52:41Z | |
| date available | 2017-09-04T16:52:41Z | |
| date copyright | 36861 | |
| date issued | 2000 | |
| identifier other | WTXADBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=4703-Sta081D206/handle/yse/116250 | |
| description abstract | This document describes a constant temperature (isothermal) aging method for testing aluminum (Al) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding. This method is valid for metallization/dielectric systems in which the dielectric is deposited onto the metallization at a temperature considerably above the intended use temperature, and above or equal to the deposition temperature of the metal. Although this is a wafer test, it is not a fast (less than 5 minutes per probe) test. It is intended to be used for lifetime prediction and failure analysis, not for production Go-NoGo lot checking. | |
| language | English | |
| title | JEDEC JEP139 | num |
| title | Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding | en |
| type | standard | |
| page | 17 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2000 | |
| contenttype | fulltext | |
| subject keywords | Metal Voiding | |
| subject keywords | Reliability | |
| subject keywords | SIV | |
| subject keywords | Stress | |
| subject keywords | Stress Voiding |