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Draft BS EN IEC 61189-3-303 Ed.1.0 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on c
25/30511428 DC
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BSI - British Standards Institution
Year: 2025
BSI - British Standards Institution
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Draft BS EN IEC 61189-3-303 Ed.1.0 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on c
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| contributor author | BSI - British Standards Institution | |
| date accessioned | 2025-09-30T22:10:24Z | |
| date available | 2025-09-30T22:10:24Z | |
| date copyright | 04 August 2025 | |
| date issued | 2025 | |
| identifier isbn | - | |
| identifier other | 000000000030511428.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=47037D83081DAC426159DD6EFDEC014A/handle/yse/347289 | |
| language | English | |
| publisher | BSI - British Standards Institution | |
| title | Draft BS EN IEC 61189-3-303 Ed.1.0 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on c | en |
| title | 25/30511428 DC | num |
| type | Standard | |
| page | 13 | |
| status | Draft | |
| tree | BSI - British Standards Institution:;2025 | |
| contenttype | Fulltext |