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English -- Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage - Edition 2.0;
French -- Produits à puces de semi-conducteurs – Partie 3: Bonnes pratiques recommandées pour la manipulation, le conditionnement et le stockage - Edition 2.0

contributor authorIEC - International Electrotechnical Commission
date accessioned2017-09-04T16:55:16Z
date available2017-09-04T16:55:16Z
date copyright2010.08.01
date issued2010
identifier otherXAXSUCAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/118745
description abstractThis technical report has been developed to facilitate the production, supply and use of semiconductor die products, including:
– wafers,
– singulated bare die,
– die and wafers with attached connection structures, and
– minimally or partially encapsulated die and wafers.
This report contains suggested good practice for the handling, packing and storage of die products.
Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.
languageEnglish, French
titleIEC TR 62258-3num
titleEnglish -- Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage - Edition 2.0en
titleFrench -- Produits à puces de semi-conducteurs – Partie 3: Bonnes pratiques recommandées pour la manipulation, le conditionnement et le stockage - Edition 2.0other
typestandard
page114
statusActive
treeIEC - International Electrotechnical Commission:;2010
contenttypefulltext


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