SMD-5962-92228

MICROCIRCUIT, DIGITAL, FAST CMOS, 10-BIT BUS INTERFACE LATCH WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON

Year: 1994

Abstract: This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example: ILLUSTRATION
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows: 
         Device type     Generic number                                   Circuit function             01              54FCT841AT      10-bit bus interface latch with noninverting three-state outputs, TTL                                            compatible inputs and limited output voltage swing.             02              54FCT841BT      10-bit bus interface latch with noninverting three-state outputs, TTL                                            compatible inputs and limited output voltage swing.             03              54FCT841CT      10-bit bus interface latch with noninverting three-state outputs, TTL                                            compatible inputs and limited output voltage swing.


The device class designator shall be a single letter identifying the product assurance level as follows: 
         Device class           Device requirements documentation                M                 Vendor self-certification to the requirements for non-JAN class B microcircuits in                                 accordance with 1.2.1 of MIL-STD-883              Q or V              Certification and qualification to MIL-I-38535


The case outline(s) shall be as designated in MIL-STD-1835, and as follows: 
     Outline letter         Descriptive designator           Terminals          Package style            K                 GDFP2-F24 or CDFP3-F24              24              Flat package           L                 GDIP3-T24 or CDIP4-T24              24              Dual-in-line package           3                 CQCC1-N28                           28              Leadless-chip-carrier package


The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. 
   Supply voltage range (VCC)  - - - - - - - - - - - - - - - - -   −0.5 V dc to +7.0 V dc    DC input voltage range (VIN)  - - - - - - - - - - - - - - - -   −0.5 V dc to VCC + 0.5 V dc   4/    DC output voltage range (VOUT)  - - - - - - - - - - - - - - -   −0.5 V dc to VCC + 0.5 V dc   4/    DC input clamp current (IIK) (VIN = −0.5 V) - - - - - - - - -   −20 mA    DC output clamp current (IOK) (VOUT) = −0.5 V and +7.0 V) - -   ±20 mA    DC output source current (IOH) per output - - - - - - - - - -   −30 mA    DC output sink current (IOL) per output - - - - - - - - - - -   +70 mA    DC VCC current (ICC)  - - - - - - - - - - - - - - - - - - - -   ±260 mA    DC ground current (IGND)  - - - - - - - - - - - - - - - - - -   ±550 mA    Storage temperature range (TSTG)  - - - - - - - - - - - - - -   −65°C to +150°C    Case temperature under bias (TBIAS) - - - - - - - - - - - - -   −65°C to +135°C    Maximum power dissipation (PD)  - - - - - - - - - - - - - - -   500 mW    Lead temperature (soldering, 10 seconds)  - - - - - - - - - -   +300°C    Thermal resistance, junction-to-case (ΘJC)  - - - - - - - - -   See MIL-STD-1835    Junction temperature (TJ) - - - - - - - - - - - - - - - - - -   +175°C


   Supply voltage range (VCC)  - - - - - - - - - - - - - - - - -   +4.5 V dc to +5.5 V dc    Input voltage range (VIN) - - - - - - - - - - - - - - - - - -   +0.0 V dc to VCC    Output voltage range (VOUT) - - - - - - - - - - - - - - - - -   +0.0 V dc to VCC    Maximum low level input voltage (VIL) - - - - - - - - - - - -   0.8 V    Minimum high level input voltage (VIH)  - - - - - - - - - - -   2.0 V    Case operating temperature range (TC) - - - - - - - - - - - -   −55°C to +125°C    Maximum input rise and fall rate  (Δt/ΔV):      (from VIN = 0.3 V to 2.7 V, 2.7 V to 0.3 V) - - - - - - - -   5 ns/V    Maximum high level output current (IOH) - - - - - - - - - - -   −12 mA    Maximum low level output current (IOL)  - - - - - - - - - - -   32 mA


   Fault coverage measurement of manufacturing      logic tests (MIL-STD-883, test method 5012) - - - - - - - -   XX percent  5/


Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device class Q devices will replace device class M devices.
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