SMD-5962-96601 REV A

DLA - CC - DLA Land and Maritime

MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, 4-BIT BIDIRECTIONAL UNIVERSAL SHIFT REGISTER, MONOLITHIC SILICON

Organization:

Year: 1997

Abstract: This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:

Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die.
The device type(s) shall identify the circuit function as follows:

         Device type           Generic number          Circuit function               01                   40104B               Radiation Hardened, CMOS,                                                        4-bit bidirectional universal shift                                                        register, with 3-state outputs.               02                   40194B               Radiation Hardened, CMOS,                                                        4-bit bidirectional universal shift                                                        register, with [R bar][E bar][S bar][E bar][T bar].

          Device class         Device requirements documentation              Q or V             Certification and qualification to the die requirements of MIL-PRF-38535.

The die details designation shall be a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix.

              Die Types               Figure number                   01                        A-1                  02                        A-2

              Die Types               Figure number                   01                        A-1                  02                        A-2

              Die Types               Figure number                   01                        A-1                  02                        A-2

                 01                        A-1                  02                        A-2

See paragraph 1.3 within the body of this drawing for details.
See paragraph 1.4 within the body of this drawing for details.
Intended Use: Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes.

URI: https://yse.yabesh.ir/std/handle/yse/158048

Collections :

DLA - CC - DLA Land and Maritime

Show full item record

contributor author	DLA - CC - DLA Land and Maritime
date accessioned	2017-09-04T17:35:06Z
date available	2017-09-04T17:35:06Z
date copyright	35773
date issued	1997
identifier other	DHGBEAAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/158048
description abstract	This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. The PIN shall be as shown in the following example: Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function 01 40104B Radiation Hardened, CMOS, 4-bit bidirectional universal shift register, with 3-state outputs. 02 40194B Radiation Hardened, CMOS, 4-bit bidirectional universal shift register, with [R bar][E bar][S bar][E bar][T bar]. Device class Device requirements documentation Q or V Certification and qualification to the die requirements of MIL-PRF-38535. The die details designation shall be a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. Die Types Figure number 01 A-1 02 A-2 Die Types Figure number 01 A-1 02 A-2 Die Types Figure number 01 A-1 02 A-2 01 A-1 02 A-2 See paragraph 1.3 within the body of this drawing for details. See paragraph 1.4 within the body of this drawing for details. Intended Use: Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes.
language	English
title	SMD-5962-96601 REV A	num
title	MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, 4-BIT BIDIRECTIONAL UNIVERSAL SHIFT REGISTER, MONOLITHIC SILICON	en
type	standard
page	26
status	Active
tree	DLA - CC - DLA Land and Maritime:;1997
contenttype	fulltext