SMD-5962-95837

DLA - CC - DLA Land and Maritime

MICROCIRCUIT, DIGITAL, 32-BIT RISC MICROPROCESSOR, 3.3 V, JTAG, MONOLITHIC SILICON

Organization:

Year: 1995

Abstract: This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Three product assurance classes consisting of space application (device class V), military high reliability (device classes M and Q), and non-traditional military (device class N) with a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". For device class N, the user is cautioned to assure that the device is appropriate for the application environment. When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:

Device classes N, Q, and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:

Device type     Generic number       Circuit function        Temperature range        Speed       01            80486DX4        32-bit microprocessor      −55°C to 125°C          75 MHz      02            80486DX4        32-bit microprocessor      −55°C to 125°C          100 MHz      03            80486DX4        32-bit microprocessor      −40°C to 125°C          75 MHz      04            80486DX4        32-bit microprocessor      −40°C to 125°C          100 MHz      05            80486DX4        32-bit microprocessor      −40°C to 110°C          75 MHz      06            80486DX4        32-bit microprocessor      −40°C to 110°C          100 MHz

The device class designator shall be a single letter identifying the product assurance level as follows:

  Device class                               Device requirements documentation         M                       Vendor self-certification to the requirements for non-JAN class B                                microcircuits in accordance with 1.2.1 of MIL-STD-883 1/         N                       Certification and qualification to MIL-I-38535 with a non-traditional                                performance environment 2/       Q or V                    Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

         Outline letter          Descriptive designator      Terminals            Package style                 X                        CMGA9-P168               168        Ceramic, pin grid array                Y                        See Figure 1             196        Leaded chip carrier with                                                                             unformed leads

The lead finish shall be as specified in MIL-I-38535 for device classes N, Q, and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

      Storage temperature range . . . . . . . . . . . . . . . .  −65°C to +150°C       Supply voltage with respect to ground range   . . . . . .   V_CC − 0.5 V to +4.6 V       Voltage on any pin with respect to ground range . . . . .  −0.5 V to V_CC + 0.5 V       Maximum power dissipation (P_D)  . . . . . . . . . .. . .    5 W       Lead temperature (soldering, 10 seconds)  . . . . . . . .   300°C       Thermal resistance, junction-to-case (ΘJ_C):         Case X  . . . . . . . . . . . . . . . . . . . . . . . .   See MIL-STD-1835         Case Y  . . . . . . . . . . . . . . . . . . . . . . . .   2.5°C/W       Maximum junction temperature (T_J) . . . . . . . . . . . .   150°C

      Case operating temperature range  . . . . . . . . . . . .   See 1.2.2       Supply voltage, (V_CC) . . . . . . . . . . . . . . . . . .   3 3 V ±5%

      Fault coverage measurement of manufacturing   logic tests (MIL-STD-883, test method 5012)   . . . . . . . .  98.5 percent

Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device class Q devices will replace device class M devices.

URI: https://yse.yabesh.ir/std/handle/yse/162313

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DLA - CC - DLA Land and Maritime

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contributor author	DLA - CC - DLA Land and Maritime
date accessioned	2017-09-04T17:39:22Z
date available	2017-09-04T17:39:22Z
date copyright	35025
date issued	1995
identifier other	DSIZDAAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/162313
description abstract	This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Three product assurance classes consisting of space application (device class V), military high reliability (device classes M and Q), and non-traditional military (device class N) with a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". For device class N, the user is cautioned to assure that the device is appropriate for the application environment. When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. The PIN shall be as shown in the following example: Device classes N, Q, and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function Temperature range Speed 01 80486DX4 32-bit microprocessor −55°C to 125°C 75 MHz 02 80486DX4 32-bit microprocessor −55°C to 125°C 100 MHz 03 80486DX4 32-bit microprocessor −40°C to 125°C 75 MHz 04 80486DX4 32-bit microprocessor −40°C to 125°C 100 MHz 05 80486DX4 32-bit microprocessor −40°C to 110°C 75 MHz 06 80486DX4 32-bit microprocessor −40°C to 110°C 100 MHz The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 1/ N Certification and qualification to MIL-I-38535 with a non-traditional performance environment 2/ Q or V Certification and qualification to MIL-I-38535 The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CMGA9-P168 168 Ceramic, pin grid array Y See Figure 1 196 Leaded chip carrier with unformed leads The lead finish shall be as specified in MIL-I-38535 for device classes N, Q, and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Supply voltage with respect to ground range . . . . . . V_CC − 0.5 V to +4.6 V Voltage on any pin with respect to ground range . . . . . −0.5 V to V_CC + 0.5 V Maximum power dissipation (P_D) . . . . . . . . . .. . . 5 W Lead temperature (soldering, 10 seconds) . . . . . . . . 300°C Thermal resistance, junction-to-case (ΘJ_C): Case X . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case Y . . . . . . . . . . . . . . . . . . . . . . . . 2.5°C/W Maximum junction temperature (T_J) . . . . . . . . . . . . 150°C Case operating temperature range . . . . . . . . . . . . See 1.2.2 Supply voltage, (V_CC) . . . . . . . . . . . . . . . . . . 3 3 V ±5% Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . 98.5 percent Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device class Q devices will replace device class M devices.
language	English
title	SMD-5962-95837	num
title	MICROCIRCUIT, DIGITAL, 32-BIT RISC MICROPROCESSOR, 3.3 V, JTAG, MONOLITHIC SILICON	en
type	standard
page	27
status	Active
tree	DLA - CC - DLA Land and Maritime:;1995
contenttype	fulltext