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MIL-STD-1310H
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY
Organization:
NAVY - SH - Naval Sea Systems Command (Ship Systems)
Year: 2009
Abstract: This document specifies standard practices to facilitate achievement of the intra-ship and intership electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation interference (IMI) requirements of MIL-STD-464.
Application. The requirements specified herein apply to metal and nonmetallic hull ships and are applicable during ship construction, overhaul, alteration, and repair. Requirements herein may be invoked upon contractor and government (military and civilian) personnel.
Tailoring. The requirements herein may be tailored with NAVSEA 05H3, Navy technical warrant authority, approval.
New materials and technology. To achieve requirements of this standard while reducing lifecycle maintenance costs, implementation of new materials and technology is encouraged. The new materials and technology should not prevent the ship from meeting all applicable MIL-STD-464 E3 performance requirements, and must not introduce EMI or safety problems. An example of new shipboard bonding and grounding technology is a flexible infrastructure deck track system designed to provide equipment reconfigurability.Intended Use: This standard specifies EMI/IMI reduction techniques, EMP protection measures, personnel safety grounding requirements and methods for installing shipboard cable ground systems. Appendix A provides guidance concerning installation and testing associated with EMI control.
Application. The requirements specified herein apply to metal and nonmetallic hull ships and are applicable during ship construction, overhaul, alteration, and repair. Requirements herein may be invoked upon contractor and government (military and civilian) personnel.
Tailoring. The requirements herein may be tailored with NAVSEA 05H3, Navy technical warrant authority, approval.
New materials and technology. To achieve requirements of this standard while reducing lifecycle maintenance costs, implementation of new materials and technology is encouraged. The new materials and technology should not prevent the ship from meeting all applicable MIL-STD-464 E3 performance requirements, and must not introduce EMI or safety problems. An example of new shipboard bonding and grounding technology is a flexible infrastructure deck track system designed to provide equipment reconfigurability.Intended Use: This standard specifies EMI/IMI reduction techniques, EMP protection measures, personnel safety grounding requirements and methods for installing shipboard cable ground systems. Appendix A provides guidance concerning installation and testing associated with EMI control.
Subject: Broadband noise (BBN)
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| contributor author | NAVY - SH - Naval Sea Systems Command (Ship Systems) | |
| date accessioned | 2017-09-04T17:42:22Z | |
| date available | 2017-09-04T17:42:22Z | |
| date copyright | 09/17/2009 | |
| date issued | 2009 | |
| identifier other | EANTOCAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/165398 | |
| description abstract | This document specifies standard practices to facilitate achievement of the intra-ship and intership electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation interference (IMI) requirements of MIL-STD-464. Application. The requirements specified herein apply to metal and nonmetallic hull ships and are applicable during ship construction, overhaul, alteration, and repair. Requirements herein may be invoked upon contractor and government (military and civilian) personnel. Tailoring. The requirements herein may be tailored with NAVSEA 05H3, Navy technical warrant authority, approval. New materials and technology. To achieve requirements of this standard while reducing lifecycle maintenance costs, implementation of new materials and technology is encouraged. The new materials and technology should not prevent the ship from meeting all applicable MIL-STD-464 E3 performance requirements, and must not introduce EMI or safety problems. An example of new shipboard bonding and grounding technology is a flexible infrastructure deck track system designed to provide equipment reconfigurability.Intended Use: This standard specifies EMI/IMI reduction techniques, EMP protection measures, personnel safety grounding requirements and methods for installing shipboard cable ground systems. Appendix A provides guidance concerning installation and testing associated with EMI control. | |
| language | English | |
| title | MIL-STD-1310H | num |
| title | SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY | en |
| type | standard | |
| page | 46 | |
| status | Active | |
| tree | NAVY - SH - Naval Sea Systems Command (Ship Systems):;2009 | |
| contenttype | fulltext | |
| subject keywords | Broadband noise (BBN) | |
| subject keywords | Cable ground system | |
| subject keywords | Intermodulation interference (IMI) | |
| subject keywords | Junction | |
| subject keywords | nonlinear | |
| subject keywords | Penetration | |
| subject keywords | Weatherproofing | |
| subject keywords | Wireway trunks |