SMD-5962-97536

DLA - CC - DLA Land and Maritime

MICROCIRCUIT, DIGITAL, MULTICHIP MICROCIRCUIT, MICROPROCESSOR WITH STATIC RAM, SILICON

Organization:

Year: 1997

Abstract: This drawing documents two product assurance class levels consisting of high reliability (device classes Q and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:

        Device type       Generic number      Memory      Operating frequency                 Circuit function              01             320MC41            128K             40 MHz             Digital signal processor                                                                                   multichip module             02             320MC41            128K             50 MHz             Digital signal processor                                                                                   multichip module

The device class designator is a single letter identifying the product assurance level as follows:

       Device class                       Device requirements documentation             M               Vendor self-certification to the requirements for MIL-STD-88 compliant,                            non-JAN class level B microcircuits in accordance with MIL-PRF-38535,                            appendix A           Q or V            Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

       Outline letter     Descriptive designator     Terminals      Package style                X             see figure 1               352      Ceramic Quad Flat Pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

   Supply voltage range (V_CC)  ....................................  −0.3 V dc to + 7.0 V dc 2/    Voltage range on any pin (V_IN) .................................  −0.3 V dc to + 7.0 V dc    Output voltage range (V_OUT)  ...................................  −0.3 V dc to + 7.0 V dc    Storage temperature range (T_STG) ...............................  −65°C to + 150°C    Maximum allowed junction temperature(T_J)  ......................  150°C    Maximum solder temperature (10s duration)  .....................  260°C    Power dissipation (P_D)  ........................................ 5.2 W    Thermal impedance, Junction-to-case (Θ_JC)  .....................  1.3°C/W

   Supply voltage range (V_CC) .....................................  +4.75 V ≤ V_CC ≤ +5.25 V    High level input voltage range (V_IH) 3/    CLKIN, COMM ....................................................  +2.6 V ≤ V_IH ≤ V_CC + 0.3 V    [C bar][S bar][T bar][R bar][B bar][x bar], [C bar][R bar][D bar][Y bar][x bar], [C bar][R bar][E bar][Q bar][x bar], [C bar][A bar][C bar][K bar][x bar] ....................................  +2.2 V ≤ V_IH ≤ V_CC + 0.3 V    All other pins  ................................................  +2.0 V ≤ V_IH ≤ V_CC + 0.3 V    Low level input voltage range (V_IL) ............................  −0.3 ≤ V_IL ≤ 0.8 V 3/    High level output current (I_OH)  ...............................  −300 µA    Low level output current (I_OL) .................................  2 mA    Case operating temperature range (T_C)  .........................  −55°C to 125°C    Maximum operating free-air temperature (T_A)  ...................  +125°C

   Fault coverage measurement of manufacturing       logic tests (MIL-STD-883, test method 5012) ................. XX percent 4/

Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device class Q devices will replace device class M devices.

URI: https://yse.yabesh.ir/std/handle/yse/175883

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DLA - CC - DLA Land and Maritime

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contributor author	DLA - CC - DLA Land and Maritime
date accessioned	2017-09-04T17:52:44Z
date available	2017-09-04T17:52:44Z
date copyright	05/21/1997
date issued	1997
identifier other	FCQAEAAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/175883
description abstract	This drawing documents two product assurance class levels consisting of high reliability (device classes Q and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. The PIN is as shown in the following example: Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. The device type(s) identify the circuit function as follows: Device type Generic number Memory Operating frequency Circuit function 01 320MC41 128K 40 MHz Digital signal processor multichip module 02 320MC41 128K 50 MHz Digital signal processor multichip module The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-88 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X see figure 1 352 Ceramic Quad Flat Pack The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Supply voltage range (V_CC) .................................... −0.3 V dc to + 7.0 V dc 2/ Voltage range on any pin (V_IN) ................................. −0.3 V dc to + 7.0 V dc Output voltage range (V_OUT) ................................... −0.3 V dc to + 7.0 V dc Storage temperature range (T_STG) ............................... −65°C to + 150°C Maximum allowed junction temperature(T_J) ...................... 150°C Maximum solder temperature (10s duration) ..................... 260°C Power dissipation (P_D) ........................................ 5.2 W Thermal impedance, Junction-to-case (Θ_JC) ..................... 1.3°C/W Supply voltage range (V_CC) ..................................... +4.75 V ≤ V_CC ≤ +5.25 V High level input voltage range (V_IH) 3/ CLKIN, COMM .................................................... +2.6 V ≤ V_IH ≤ V_CC + 0.3 V [C bar][S bar][T bar][R bar][B bar][x bar], [C bar][R bar][D bar][Y bar][x bar], [C bar][R bar][E bar][Q bar][x bar], [C bar][A bar][C bar][K bar][x bar] .................................... +2.2 V ≤ V_IH ≤ V_CC + 0.3 V All other pins ................................................ +2.0 V ≤ V_IH ≤ V_CC + 0.3 V Low level input voltage range (V_IL) ............................ −0.3 ≤ V_IL ≤ 0.8 V 3/ High level output current (I_OH) ............................... −300 µA Low level output current (I_OL) ................................. 2 mA Case operating temperature range (T_C) ......................... −55°C to 125°C Maximum operating free-air temperature (T_A) ................... +125°C Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ................. XX percent 4/ Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device class Q devices will replace device class M devices.
language	English
title	SMD-5962-97536	num
title	MICROCIRCUIT, DIGITAL, MULTICHIP MICROCIRCUIT, MICROPROCESSOR WITH STATIC RAM, SILICON	en
type	standard
page	24
status	Active
tree	DLA - CC - DLA Land and Maritime:;1997
contenttype	fulltext