NASA-LLIS-0330
Lessons Learned - Debonding Due to Pressure Trapped in Voids with Subsequent Exposure to External Reduced Pressure
Year: 1993
Abstract: Description of Driving Event:
KSC post flight inspections of RSRM-2 (STS 27) showed a 3.5" x 3.5" piece of JPS cork missing from the right hand center field joint at 185 degrees indicating debris. An unbond also existed between the EPDM moisture seal and the extruded cork at this missing location. The missing cork was located at the kevlar band buckle, where the JPS cork interface had been cut to fit over the buckle, creating an unvented void area under the cork.
KSC post flight inspections of RSRM-2 (STS 27) showed a 3.5" x 3.5" piece of JPS cork missing from the right hand center field joint at 185 degrees indicating debris. An unbond also existed between the EPDM moisture seal and the extruded cork at this missing location. The missing cork was located at the kevlar band buckle, where the JPS cork interface had been cut to fit over the buckle, creating an unvented void area under the cork.
Subject: Hardware
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| contributor author | NASA - National Aeronautics and Space Administration (NASA) | |
| date accessioned | 2017-09-04T15:18:04Z | |
| date available | 2017-09-04T15:18:04Z | |
| date copyright | 06/14/1993 | |
| date issued | 1993 | |
| identifier other | MPAEQCAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/17620 | |
| description abstract | Description of Driving Event: KSC post flight inspections of RSRM-2 (STS 27) showed a 3.5" x 3.5" piece of JPS cork missing from the right hand center field joint at 185 degrees indicating debris. An unbond also existed between the EPDM moisture seal and the extruded cork at this missing location. The missing cork was located at the kevlar band buckle, where the JPS cork interface had been cut to fit over the buckle, creating an unvented void area under the cork. | |
| language | English | |
| title | NASA-LLIS-0330 | num |
| title | Lessons Learned - Debonding Due to Pressure Trapped in Voids with Subsequent Exposure to External Reduced Pressure | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | NASA - National Aeronautics and Space Administration (NASA):;1993 | |
| contenttype | fulltext | |
| subject keywords | Hardware | |
| subject keywords | Parts Materials & Processes |

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