درباره ما
SMD-5962-89593 REV D
MICROCIRCUIT, DIGITAL, CMOS, 32-BIT DMA CONTROLLER WITH INTEGRATED SYSTEM SUPPORT PERIPHERALS, MONOLITHIC SILICON
Year: 1995
Abstract: This drawing describes device requirements for class 8 microcircuits in accordance with 1.2.1 of MIL-STD-883. "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:![CHART]()
The device type(s) shall identify the circuit function as follows:
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications original equipment), design applications, and logistics purposes.
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Frequency 01 82380 32-bit DMA controller with integrated 16 MHz system support peripherals 02 82380 32-bit DMA controller with integrated 20 MHz system support peripherals 03 82380 32-bit DNA controller with integrated 25 MHz system support peripherals
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style Y See figure 1 164 Leaded chip carrier leads Z CMGA6-P132 132 Pin grid array package
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Voltage on any pin with respect to ground - - - - - - −0.5 V dc to +6.5 V dc Power dissipation (PD ) - - - - - - - - - - - - - - - 2.0 W Lead temperature (soldering, 10 seconds)- - - - - - - +300°C Thermal resistance. junction-to-case (ΘJC): Case Z - - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case Y - - - - - - - - - - - - - - - - - - - - - - +8°C/W Junction temperature (TJ) - - - - - - - - - - - - - - +175°C
Case operating temperature range (TC) - - - - - - - - −55°C to +125°C Supply voltage range (VCC) - - - - - - - - - - - - - +4.75 V dc to +5.25 V dc
Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications original equipment), design applications, and logistics purposes.
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