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SMD-5962-93112
MICROCIRCUIT, DIGITAL, CMOS, PROGRAMMABLE SKEW CLOCK BUFFER, MONOLITHIC SILICON
| contributor author | DLA - CC - DLA Land and Maritime | |
| date accessioned | 2017-09-04T17:59:12Z | |
| date available | 2017-09-04T17:59:12Z | |
| date copyright | 09/13/1994 | |
| date issued | 1994 | |
| identifier other | FTNYDAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/182301 | |
| description abstract | This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. The PIN shall be as shown in the following example: Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function Skew error 01 7B992 Programmable skew clock buffer 0.7 ns The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535 The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CQCC1-N32 32 Leadless chip carrier The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. Supply voltage range (VCCN, VCCQ) - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range (VIN)- - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Output current into outputs (Low) (IOL) - - - - - - - - - - 64 mA Storage temperature range (TSTG)- - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD)- - - - - - - - - - - - - - - 911 mW Lead temperature (soldering, 10 seconds)- - - - - - - - - - +260°C Thermal resistance, junction-to-case (ΘJC)- - - - - - - - - See MIL-STD-1835 Junction temperature (TJ) - - - - - - - - - - - - - - - - - +175°C Supply voltage range (VCCN, VCCQ) - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Input voltage range (VIN) - - - - - - - - - - - - - - - - - 0.0 V dc to VCCQ Output voltage range (VOUT) - - - - - - - - - - - - - - - - 0.0 V dc to VCCN High Level input voltage range (VIH, VIHH): VIH - - - - - - - - - - - - - - - - - - - - - - - - - - - VCCQ − 1.35 V dc to VCCQ 4/ VIHH- - - - - - - - - - - - - - - - - - - - - - - - - - - VCCQ − 1.00 V dc to VCCQ 5/ 6/ Mid level input voltage range (VIMM) - - - - - - - - - - - VCCQ/2 ±500 mV dc 5/ Low level input voltage range (VIL, VILL): VIL - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.0 V dc to 1.35 V dc 4/ VILL- - - - - - - - - - - - - - - - - - - - - - - - - - - 0.0 V dc to 1.0 V dc 5/ 6/ Case operating temperature (TC) - - - - - - - - - - - - - - −55°C to +125°C Input rise or fall time (tr, tf): (0.2VCC to 0.8VCC: 0.8VCC to 0.2VCC)- - - - - - - - - - - 0 to 3 ns Maximum high level output current (IOH) - - - - - - - - - - −40 mA Maximum low level output current (IOL)- - - - - - - - - - - +46 mA Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - XX percent 7/ Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device class Q devices will replace device class M devices. | |
| language | English | |
| title | SMD-5962-93112 | num |
| title | MICROCIRCUIT, DIGITAL, CMOS, PROGRAMMABLE SKEW CLOCK BUFFER, MONOLITHIC SILICON | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | DLA - CC - DLA Land and Maritime:;1994 | |
| contenttype | fulltext |
