SMD-5962-90976
MICROCIRCUIT, CHMOS SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 256 BYTES OF ON CHIP DATA RAM, MONOLITHIC SILICON
Organization:
DLA - CC - DLA Land and Maritime
Year: 1992
Abstract: This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B. and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non RHA device.
The device types shall identify the circuit function as follows:
This device class designator shall be a single letter identifying the product assurance level as follows:
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, or C are considered acceptable and interchangeable without preference.
Intended Use: Microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device classes B and Q devices will replace device class M devices.
The PIN shall be as shown in the following example:
Device classes M, B. and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non RHA device.
The device types shall identify the circuit function as follows:
Device type Generic number Circuit function 01 80C51FB CHMOS single chip 8-bit microcontroller 02 80C51FB-16 CHMOS single-chip 8-bit microcontroller
This device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for NON-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style T See figure 1 44 J-leaded ceramic chip carrier U CQCCI-N44 44 Square leadless chip carrier X GDIP1-T40 or 40 Dual-in-line CDIP2-T40 Z See figure 1 44 Gullwing-lead ceramic chip carrier
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, or C are considered acceptable and interchangeable without preference.
Storage temperature range . . . . . . . . . . . . . . . . . . −65°C to +150°C Voltage on [E bar][A bar]/Vpp pin to VSS .. . . . . . . . . . . . . . . . . . . . 0.0 V dc to + 13.0 V dc Voltage on any other pin to VSS . . . . . . . . . . . . . . . −0.5 V dc to +6.5 V dc Maximum IOL per I/O pin . . . . . . . . . . . . . . . . . . . 15 mA Power dissipation (PD) . . . . . . . . . . . . . . . . . . . . 1.5 W 1/ Lead temperature (soldering 10 seconds) . . . . . . . . . . . 265°C Thermal resistance, Junction-to-case (θJC): Cases U and X . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Cases T and Z . . . . . . . . . . . . . . . . . . . . . . . 14°C/W Junction temperature . . . . . . . . . . . . . . . . . . . . . +150°C
Case Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +125°C 2/ Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . +4.0 V dc to 6.0 V dc Oscillator frequency: Device 01 . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 MHz to 16 MHz Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 MHz to 16 MHz
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . XX percent 3/
Intended Use: Microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device classes B and Q devices will replace device class M devices.
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| contributor author | DLA - CC - DLA Land and Maritime | |
| date accessioned | 2017-09-04T18:00:33Z | |
| date available | 2017-09-04T18:00:33Z | |
| date copyright | 33912 | |
| date issued | 1992 | |
| identifier other | AAYWDAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/183596 | |
| description abstract | This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN. The PIN shall be as shown in the following example: Device classes M, B. and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non RHA device. The device types shall identify the circuit function as follows: Device type Generic number Circuit function 01 80C51FB CHMOS single chip 8-bit microcontroller 02 80C51FB-16 CHMOS single-chip 8-bit microcontroller This device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for NON-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535 The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style T See figure 1 44 J-leaded ceramic chip carrier U CQCCI-N44 44 Square leadless chip carrier X GDIP1-T40 or 40 Dual-in-line CDIP2-T40 Z See figure 1 44 Gullwing-lead ceramic chip carrier The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, or C are considered acceptable and interchangeable without preference. Storage temperature range . . . . . . . . . . . . . . . . . . −65°C to +150°C Voltage on [E bar][A bar]/Vpp pin to VSS .. . . . . . . . . . . . . . . . . . . . 0.0 V dc to + 13.0 V dc Voltage on any other pin to VSS . . . . . . . . . . . . . . . −0.5 V dc to +6.5 V dc Maximum IOL per I/O pin . . . . . . . . . . . . . . . . . . . 15 mA Power dissipation (PD) . . . . . . . . . . . . . . . . . . . . 1.5 W 1/ Lead temperature (soldering 10 seconds) . . . . . . . . . . . 265°C Thermal resistance, Junction-to-case (θJC): Cases U and X . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Cases T and Z . . . . . . . . . . . . . . . . . . . . . . . 14°C/W Junction temperature . . . . . . . . . . . . . . . . . . . . . +150°C Case Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +125°C 2/ Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . +4.0 V dc to 6.0 V dc Oscillator frequency: Device 01 . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 MHz to 16 MHz Device 02 . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 MHz to 16 MHz Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . XX percent 3/ Intended Use: Microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device classes B and Q devices will replace device class M devices. | |
| language | English | |
| title | SMD-5962-90976 | num |
| title | MICROCIRCUIT, CHMOS SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 256 BYTES OF ON CHIP DATA RAM, MONOLITHIC SILICON | en |
| type | standard | |
| page | 27 | |
| status | Active | |
| tree | DLA - CC - DLA Land and Maritime:;1992 | |
| contenttype | fulltext |

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