درباره ما
SMD-5962-90669
MICROCIRCUIT, DIGITAL, FAST CMOS, BINARY UP/DOWN COUNTER, TTL COMPATIBLE, MONOLITHIC SILICON
Year: 1992
Abstract: This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:![CHART]()
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
The device class designator shall be a single letter identifying the product assurance level as follows:
For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment) design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device classes B and Q devices will replace device class M devices.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 54FCT193 Binary, up/down counter 02 54FCT193A Binary, up/down counter
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-M-38535
For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.
Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package 2 C-2 (20-terminal, .385" ×.385" × .100"), square chip carrier package
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range (VIN) - - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc 2/ Output voltage range (VOUT) - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc 2/ DC input diode current (IIK) - - - - - - - - - - - - - - - - - - - −20 mA DC output diode current (IOK) - - - - - - - - - - - - - - - - - - −50 mA DC output current - - - - - - - - - - - - - - - - - - - - - - - - ±100 mA Maximum power dissipation (PD) - - - - - - - - - - - - - - - - - - 500 mW 3/ Thermal resistance, junction-to-case, (ΘJC)- - - - - - - - - - - - See MIL-M-38510, appendix C Storage temperature range - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - +300°C
Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum low-level input voltage (VIL) - - - - - - - - - - - - - - 0.8 V dc Minimum high-level input voltage (VIH) - - - - - - - - - - - - - - 3.0 V dc 4/ Case operating temperature (TC) - - - - - - - - - - - - - - - - - −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - XX percent 5/
Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment) design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device classes B and Q devices will replace device class M devices.
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