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SMD-5962-82021 REV F

MICROCIRUITS, MICROPROCESSOR, 16-BIT, N-CHANNEL, MONOLITHIC SILICON

Organization:
DLA - CC - DLA Land and Maritime
Year: 1992

Abstract: This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example: CHART
The device type(s) shall identify the circuit function as follows:
       Device type     Generic number                  Circuit function             01              68000-6           16-bit fixed instruction microprocessor            02              68000-8           16-bit fixed instruction microprocessor            03              68000-10          16-bit fixed instruction microprocessor            04              68000-12          16-bit fixed instruction microprocessor


The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
     Outline letter         Descriptive designator         Terminals             Package style             T                      CMGA2-PN                     68        Grid array            U                      See figure 1                 68        Leaded chip carrier            X                      CQCCl-N68                    68        Square leadless chip carrier with thermal pad            Y                      CDIP1-T64                    64        Dual-in-line package            Z                      CQCCl-N68                    68        Square leadless chip carrier


      Supply voltage range    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   −0.3 V dc to +7.0 V dc       Storage temperature range   . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   −65°C to +150°C       Maximum power dissipation, (PD) . . . . . . . . . . . . . . . . . . . . . . . . . . .   1.75 W       Lead temperature (soldering 5-seconds)  . . . . . . . . . . . . . . . . . . . . . . .   +270°C       Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   150°C       Thermal resistance, junction to case (ΘJC):         Case T  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   15°C/W         Case U  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   10°C/W         Cases X, Y, and Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   See MIL-STD-1835


     Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . .    4.75 V dc to 5.25 V dc      High level input voltage range (logic inputs) (VIH). . . . . . . . . .    2.0 V dc to VCC      Low level input voltage range (logic inputs) (VIL) . . . . . . . . . .    GND  to 0.8 V dc      Minimum high level output voltage. . . . . . . . . . . . . . . . . . .    2.4 V dc V       Maximum tow level output voltage . . . . . . . . . . . . . . . . . . .    0.5 V dc      Frequency of operation:        Device type 01 . . . . . . . . . . . . . . . . . . . . . . . . . . .    4.0 to 6.0 MHz        Device type 02 . . . . . . . . . . . . . . . . . . . . . . . . . . .    4.0 to 8.0 MHz        Device type 03 . . . . . . . . . . . . . . . . . . . . . . . . . . .    4.0 to 10.0 MHz        Device type 04 . . . . . . . . . . . . . . . . . . . . . . . . . . .    4.0 to 12.5 MHz      Case operating temperature range (TC). . . . . . . . . . . . . . . . .    −55°C to +110°C


Intended Use: Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. When a military specification exists and the product covered by this drawing has been qualified for listing on QPL-38510, the device specified herein will be inactivated and will not be used for new design. The QPL-38510 product shall be the preferred item for all applications.
URI: https://yse.yabesh.ir/std/handle/yse/199745
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    SMD-5962-82021 REV F

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contributor authorDLA - CC - DLA Land and Maritime
date accessioned2017-09-04T18:16:47Z
date available2017-09-04T18:16:47Z
date copyright33882
date issued1992
identifier otherHNWWDAAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/199745
description abstractThis drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example: CHART
The device type(s) shall identify the circuit function as follows:
       Device type     Generic number                  Circuit function             01              68000-6           16-bit fixed instruction microprocessor            02              68000-8           16-bit fixed instruction microprocessor            03              68000-10          16-bit fixed instruction microprocessor            04              68000-12          16-bit fixed instruction microprocessor


The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
     Outline letter         Descriptive designator         Terminals             Package style             T                      CMGA2-PN                     68        Grid array            U                      See figure 1                 68        Leaded chip carrier            X                      CQCCl-N68                    68        Square leadless chip carrier with thermal pad            Y                      CDIP1-T64                    64        Dual-in-line package            Z                      CQCCl-N68                    68        Square leadless chip carrier


      Supply voltage range    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   −0.3 V dc to +7.0 V dc       Storage temperature range   . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   −65°C to +150°C       Maximum power dissipation, (PD) . . . . . . . . . . . . . . . . . . . . . . . . . . .   1.75 W       Lead temperature (soldering 5-seconds)  . . . . . . . . . . . . . . . . . . . . . . .   +270°C       Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   150°C       Thermal resistance, junction to case (ΘJC):         Case T  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   15°C/W         Case U  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   10°C/W         Cases X, Y, and Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   See MIL-STD-1835


     Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . .    4.75 V dc to 5.25 V dc      High level input voltage range (logic inputs) (VIH). . . . . . . . . .    2.0 V dc to VCC      Low level input voltage range (logic inputs) (VIL) . . . . . . . . . .    GND  to 0.8 V dc      Minimum high level output voltage. . . . . . . . . . . . . . . . . . .    2.4 V dc V       Maximum tow level output voltage . . . . . . . . . . . . . . . . . . .    0.5 V dc      Frequency of operation:        Device type 01 . . . . . . . . . . . . . . . . . . . . . . . . . . .    4.0 to 6.0 MHz        Device type 02 . . . . . . . . . . . . . . . . . . . . . . . . . . .    4.0 to 8.0 MHz        Device type 03 . . . . . . . . . . . . . . . . . . . . . . . . . . .    4.0 to 10.0 MHz        Device type 04 . . . . . . . . . . . . . . . . . . . . . . . . . . .    4.0 to 12.5 MHz      Case operating temperature range (TC). . . . . . . . . . . . . . . . .    −55°C to +110°C


Intended Use: Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. When a military specification exists and the product covered by this drawing has been qualified for listing on QPL-38510, the device specified herein will be inactivated and will not be used for new design. The QPL-38510 product shall be the preferred item for all applications.
languageEnglish
titleSMD-5962-82021 REV Fnum
titleMICROCIRUITS, MICROPROCESSOR, 16-BIT, N-CHANNEL, MONOLITHIC SILICONen
typestandard
page31
statusActive
treeDLA - CC - DLA Land and Maritime:;1992
contenttypefulltext
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